Agenda Harvest Imaging Forum 2023 :

1. From visible to beyond-visible imaging

• Extending the imaging capabilities beyond the visible domain:

• To higher photon energy, Ultra-Violet imaging : a “natural” extension of visible BSI sensor, how and what for ?

• To other light dimension : Polarization Imaging, principles, implantations , applications,

• To longer light wavelengths, the Infrared domain : motivations and applications

• The role of Silicon in beyond visible imaging

• Different imaging modes: reflective (passive/active) and self- emissive ("thermal") imaging modes

• Influence of radiation transmitting media

• Classification of Infrared Imaging windows.

• Detection principles: photonic and thermal detector

• Non-silicon semiconductors for photon detection: Ge, III-V and II-VI materials

• The promises of nanotechnologies for beyond-visible imaging

• The general landscape of non-visible technologies

• Figure of merits of non-visible imaging

2. Imaging in the Short Wave Infrared (SWIR)

• The well-established InGaAs photodiodes for SWIR

• The CMOS Readout Integrated Circuit (ROIC)

• Comparison with monolithic visible imagers at the circuit level

• The convergence way thanks to hybrid-bonding

• The challengers for SWIR imaging – Germanium on Silicon, Quantum Dot films

• Applications and new perspectives

3. Cooled imagers for the Medium and Long Wave Infrared (MWIR and LWIR)

• InSb and HgCdTe photodiodes : the well-established technologies

• The new III-V challengers : Type II Superlattices

• The need for deep and cryogenic cooling

• The CMOS Readout Integrated Circuit (ROIC) at cryogenic temperature

• Trends and perspectives for uncooled imagers: the challenges of high temperature operation (HOT) and miniaturization

4. Uncooled imagers for thermal imaging

• Applications of thermal imaging : the motivation for low cost technologies

• The combination of CMOS and Micromachining: the key for large scale production

• The Thermopile approach

• The Microbolometer imagers: technologies and implementations

• The CMOS Readout for Microbolometer arrays

• New trends and perspectives – The thermal imaging module.