The fight on stacking has began.\u00a0 After Sony’s presentation at ISSCC, others are following on the stacked road.\u00a0 Omnivision shows their architecture on stacking with the TSV’s outside the imaging array.\u00a0 They claim to have the technology ready to start production of stacked imagers with a pixel pitch of 1 um.\u00a0 Olympus showed their improved work over the one presented two years ago at ISSCC.\u00a0 Olympus has a contact between the two silicon layers for every group of 2×2 pixels.\u00a0 They created a 16M pixel device with 4M direct contacts, each with 7.6 um pitch.\u00a0\u00a0Extra added to the ISSCC paper is the CDS capability buried in the second layer of silicon.\u00a0 Also remarkable : all circuitry on the top level silicon is p-type !\u00a0 Because a metal light shield is used between the two layers of silicon, a PLS of -180 dB is obtained.\u00a0 Giant steps forward in their stacked wafer-to-wafer\u00a0imager process.<\/p>\n
Like Olympys, also \u00a0NHK showed a wafer-to-wafer bonding using Au contacts.\u00a0 Nice to get also some information about the technology of the bonding itself.\u00a0 TSMC had a paper about the photon emission in a stacked CIS.\u00a0 Of course the second layer with the processing circuitry in a stacked image sensor is not designed\/optimized for imaging purposes, and consequently during operation the circuitry present in this layer can generate some light that can be captured by the top layer.\u00a0 This is no longer PLS but SLP, because the light is coming in the opposite direction.\u00a0 Also the last paper in this session came from TSMC and dealt with dark FPN improvement by a stacked CIS process.\u00a0 Focus was put on the decomposition of the FPN by biasing\/switching the TG in an appropriate way.<\/p>\n
Albert, 23-06-2015.<\/p>\n","protected":false},"excerpt":{"rendered":"
The fight on stacking has began.\u00a0 After Sony’s presentation at ISSCC, others are following on the stacked road.\u00a0 Omnivision shows their architecture on stacking with the TSV’s outside the imaging array.\u00a0 They claim to have the technology ready to start production of stacked imagers with a pixel pitch of 1 um.\u00a0 Olympus showed their improved […]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[1],"tags":[],"class_list":["post-1447","post","type-post","status-publish","format-standard","hentry","category-uncategorized"],"_links":{"self":[{"href":"https:\/\/harvestimaging.com\/blog\/index.php?rest_route=\/wp\/v2\/posts\/1447","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/harvestimaging.com\/blog\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/harvestimaging.com\/blog\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/harvestimaging.com\/blog\/index.php?rest_route=\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/harvestimaging.com\/blog\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=1447"}],"version-history":[{"count":4,"href":"https:\/\/harvestimaging.com\/blog\/index.php?rest_route=\/wp\/v2\/posts\/1447\/revisions"}],"predecessor-version":[{"id":1451,"href":"https:\/\/harvestimaging.com\/blog\/index.php?rest_route=\/wp\/v2\/posts\/1447\/revisions\/1451"}],"wp:attachment":[{"href":"https:\/\/harvestimaging.com\/blog\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=1447"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/harvestimaging.com\/blog\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=1447"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/harvestimaging.com\/blog\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=1447"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}